Creep Properties Assessment by Shear Punch Creep Test and IMC Morphology of Aged Pb-Free Solder Joint/UBM
نویسندگان
چکیده
منابع مشابه
Creep Behavior of a Sn-Ag-Bi Pb-Free Solder
Compression creep tests were performed on the ternary 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) Pb-free alloy. The test temperatures were: −25 °C, 25 °C, 75 °C, 125 °C, and 160 °C (± 0.5 °C). Four loads were used at the two lowest temperatures and five at the higher temperatures. The specimens were tested in the as-fabricated condition or after having been subjected to one of two air a...
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ژورنال
عنوان ژورنال: Metals
سال: 2019
ISSN: 2075-4701
DOI: 10.3390/met9020209